Report Details

Chemicals & Materials

Spherical Boron Nitride for Electronic Packaging Market Size, By Product Type (Below 50μm, 50μm-100μm, Above 100μm), By Application (Electronic Packaging, Thermal Interface Material, Al Base CCL, Thermally Conductive Plastic, Others), By Key Players (Saint-Gobain, 3M, xtra GmbH, Bestry Performance Materials, Suzhou Ginet New Material, Shandong Fangyuan, Suzhou Nutpool Materials Technology), By Regional Outlook And Competitive Landscape

By Type : Below 50μm, 50μm-100μm, Above 100μm

By Application : Electronic Packaging, Thermal Interface Material, Al Base CCL, Thermally Conductive Plastic, Others

ID: XI722030 | Published: Jan 2024 | Pages: 143 | Format: Electronic (PDF) | Industry: Chemicals & Materials

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